Integrated circuit device

ABSTRACT

The invention provides an integrated circuit device. The integrated circuit device includes a substrate. A first capacitor is disposed on the substrate. A first metal pattern is coupled to a first electrode of the first capacitor. A second metal pattern is coupled to a first electrode of the second capacitor. A third metal pattern is disposed over the first and second metal patterns. The third metal pattern covers the first capacitor, the first metal pattern and the second metal pattern. The third metal pattern is electrically grounding. An inductor is disposed over the third metal pattern.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No.62/082,674 filed Nov. 21, 2014, the entirety of which is incorporated byreference herein. This Application also claims priority of Taiwan PatentApplication No. 104117729, filed on Jun. 2, 2015, the entirety of whichis incorporated by reference herein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an integrated circuit device, and inparticular it provides an arrangement for the capacitor of an integratedcircuit device with an on-chip inductor.

2. Description of the Related Art

Spiral inductors are widely used in the designs of radio-frequency(RF)/high speed integrated circuit devices. Usually, electric devicesare prohibited from being placed in the region occupied by the inductorsto prevent the inductors from experiencing crosstalk or any loss ofefficiency. Also, the eddy current loss effect and the coupling effectcan be reduced. Conventional inductors, however, occupy a considerablylarge area of the silicon substrate. Therefore, the conventionalinductors cause a bottleneck in the fabrication cost of the chips.

Thus, a novel integrated circuit device is desirable.

BRIEF SUMMARY OF THE INVENTION

An integrated circuit device is provided. An exemplary embodiment of anintegrated circuit device includes a substrate. A first capacitor isdisposed on the substrate. The first capacitor includes a first welldoped region extended from a surface of the substrate to a portion ofthe substrate. A first gate structure is disposed on the first welldoped region. A source and a drain respectively positioned on twoopposite sides of the first gate structure. The first gate structureserves as the first electrode, the source and the drain serve as thesecond electrode. A first metal pattern is coupled to a first electrodeof the first capacitor. A second metal pattern is coupled to a firstelectrode of the second capacitor. A third metal pattern is disposedover the first and second metal patterns and covering the firstcapacitor, the first metal pattern, and the second metal pattern. Thethird metal pattern is electrically grounding. An inductor is disposedover the third metal pattern.

Another exemplary embodiment of an integrated circuit device includes asubstrate. A first well doped region and a second well doped region aredisposed on the substrate. A first capacitor is disposed on the firstwell doped region of the substrate. A second capacitor is disposed onthe second well doped region of the substrate. A first metal patternincludes a first metal trace and a second metal trace. The first metaltrace and the second metal trace are coupled to a ground node. Aninductor is disposed over the first metal pattern. The first metal traceis arranged between the first well doped region of the substrate and theinductor. The second metal trace is arranged between the second welldoped region of the substrate and the inductor.

A detailed description is given in the following embodiments withreference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention can be more fully understood by reading thesubsequent detailed description and examples with references made to theaccompanying drawings, wherein:

FIG. 1 is a plan-view of an integrated circuit device in accordance withsome embodiments of the disclosure;

FIG. 2 is an enlarged view of a portion of FIG. 1, showing a layout ofground shield metal patterns, which are disposed under an inductor, andthe metal patterns, which are disposed under the ground shield metalpatterns and used for coupling electrode of a capacitor, in accordancewith some embodiments of the disclosure;

FIG. 3 is a cross-sectional view along a line C-C′ of FIG. 2, showingseveral metal-oxide-semiconductor (MOS) capacitors disposed underdifferent ground shield metal patterns in accordance with someembodiments of the disclosure;

FIG. 4 is a cross-sectional view along a line D-D′ of FIG. 2, showingseveral metal-oxide-semiconductor (MOS) capacitors disposed under asingle ground shield metal pattern in accordance with some embodimentsof the disclosure;

FIG. 5 is a cross-sectional view along a line C-C′ of FIG. 2, showingseveral metal-oxide-metal (MOM) capacitors disposed under differentground shield metal patterns in accordance with some embodiments of thedisclosure;

FIG. 6 is a cross-sectional view along a line C-C′ of FIG. 2, showingseveral metal-oxide-metal (MOM) capacitors disposed under differentground shield metal patterns in accordance with some other embodimentsof the disclosure; and

FIG. 7 is a cross-sectional view along a line C-C′ of FIG. 2, showingseveral metal-oxide-semiconductor (MOS) capacitors and metal-oxide-metal(MOM) capacitors disposed under different ground shield metal patternsin accordance with some other embodiments of the disclosure.

DETAILED DESCRIPTION OF THE INVENTION

The following description is of the best-contemplated mode of carryingout the invention. This description is made for the purpose ofillustrating the general principles of the invention and should not betaken in a limiting sense. The scope of the invention is determined byreference to the appended claims.

The present invention will be described with respect to particularembodiments and with reference to certain drawings, but the invention isnot limited thereto and is only limited by the claims. The drawingsdescribed are only schematic and are non-limiting. In the drawings, thesize of some of the elements may be exaggerated for illustrativepurposes and not drawn to scale. The dimensions and the relativedimensions do not correspond to actual dimensions in the practice of theinvention.

Embodiments provide an integrated circuit device, and in particularprovide an arrangement of a capacitor. The integrated circuit device isconstructed by disposing a capacitor in a region between an on-chipinductor and a substrate. Also, the capacitor is disposed directly underthe ground shield metal patterns, which are used to shield theon-chip-inductor. In some other embodiments, the capacitor may be usedas a de-coupling capacitor of a power net.

FIG. 1 is a plan-view of an integrated circuit device 500 in accordancewith some embodiments of the disclosure. In some embodiments, theintegrated circuit device 500 mainly includes a substrate 200, aninductor 250, a plurality of ground shield metal patterns 300 and atleast one capacitor (not shown in FIG. 1). The capacitor would bedescribed using FIGS. 3-7. As shown in FIG. 1, the inductor 250 and theground shield metal patterns 300 are portions of elements of aninterconnection structure (the interconnection structure comprises aplurality metal layers and a plurality of dielectric layersalternatively laminating the metal layers), which is disposed over thesubstrate 200. Also, the ground shield metal patterns are metal patternscoupled to ground. Additionally, to clearly show the relationship amongthe positions of the substrate 200, the inductor 250 and ground shieldmetal patterns 300, the metal layers and the dielectric layers, whichare positioned between the inductor 250 and the metal patterns 300, atdifferent layered levels in the interconnection structure are not shownin the figures.

In one embodiment, the substrate 200 may include a silicon substrate, asilicon germanium (SiGe) substrate, a bulk semiconductor substrate, astrained semiconductor substrate, a compound semiconductor substrate, asilicon-on-insulator (SOI) substrate or other commonly usedsemiconductor substrates. Additionally, in one embodiment, a p-typeimpurity or an n-type impurity may be implanted onto the substrate 200to change the conduction type of the substrate 200. In some embodiments,the substrate 200 may include one or more isolation features formedextended from a surface of the semiconductor substrate 200 to a portionof the semiconductor substrate 200. In some embodiments, the isolationfeatures may comprise local oxidation of silicon (LOCOS) features orshallow trench isolation (STI) features. The isolation features may beused to define active regions of the substrate 200.

In one embodiment, the inductor 250 is disposed over the substrate 200.The inductor 250 is formed using the top metal layer (Mtop) of theinterconnection structure. Alternatively, the inductor 250 is formedusing the top metal layer (Mtop) and the second top metal layer (Mtop−1)of the interconnection structure. As shown in FIG. 1, the inductor mayinclude an inner-ring portion 252 and an outer-ring portion 254, whichare parallel to each other and concentrically disposed on the substrate200. The inner-ring portion 252 and the outer-ring portion 254 may beconnected to each other through a connection portion 256. Also, theshapes of the inner-ring portion 252 and the outer-ring portion 254 mayinclude a circular shape, a rectangular shape or a polygonal shape. Whenthe inner-ring portion 252 and the outer-ring portion 254 are formed bythe top metal layer (Mtop) of the interconnection structure, theconnection portion 256 may be formed by metal strips and via plugs,where in at least one is used to connect to both the top metal layer(Mtop) and the secondary top metal layer (Mtop−1), and the secondary topmetal layer (Mtop−1) of the interconnection structure. Alternatively,when the inner-ring portion 252 and the outer-ring portion 254 areformed by the top metal layer (Mtop) and the secondary top metal layer(Mtop−1) of the interconnection structure, the connection portion 256may be formed by a via plug, which is used to connect to the top metallayer (Mtop) and the secondary top metal layer (Mtop−1).

In one embodiment, the ground shield metal patterns 300 are disposeddirectly under the inductor 250. The ground shield metal patterns 300and the inductor 250 respectively belong to different metal layeredlevels of the interconnection structure. That is to say, the groundshield metal patterns 300 and the inductor 250 occupy differentrespective metal layered levels of the interconnection structure. Insome other embodiments, the ground shield metal patterns 300 and theinductor 250 are separated from each other by at least two metal layers.For example, of the interconnection structures that are formed usingseven layers of metal technology, the inductor 250 is formed using theseventh metal layer (M7) and/or the sixth metal layer (M6), and theground shield metal patterns 300 is formed using the second metal layer(M2), the third metal layer (M3), or the fourth metal layer (M4). Insome embodiments, the ground shield metal patterns 300 serve as groundshield metal patterns for the inductor 250. As shown in FIG. 1, the areaoccupied by the ground shield metal patterns 300 is greater than thearea occupied by the inductor 250. Therefore, the boundary of the areaoccupied by the inductor 250 is positioned within the boundary of thearea occupied by the ground shield metal patterns 300.

FIG. 2 is an enlarged view of a portion 600 of FIG. 1, showing a layoutof ground shield metal patterns and metal patterns, wherein metalpatterns are disposed under the ground shield metal patterns and usedfor coupling electrode of a capacitor, in accordance with someembodiments of the disclosure. As shown in FIG. 2, the shapes of theground shield metal patterns 300 are metal strips (or traces) aresubstantially the same. Please refer to FIGS. 1 and 2, the diagonal lineA1-A1′ and the diagonal line A2-A2′, which cross opposite corners of theinductor 250, may divide the area occupied by ground shield metalpatterns 300 into four regions. The ground shield metal patterns 300positioned in one of the regions are separated from those in another ofthe regions, so that the coupling effect can be reduced. Also, theground shield metal patterns 300 positioned in each of the regions aredisposed parallel to one another and separated by a single space S.Additionally, the ground shield metal patterns 300 positioned in one ofthe regions are arranged substantially perpendicular to the groundshield metal patterns 300 positioned in the adjacent regions. The groundshield metal patterns 300 positioned in one of the regions are arrangedseparated from ground shield metal patterns 300 positioned in one of theregions are arranged by the space S. Therefore, the ground shield metalpatterns 300 positioned in the opposite regions don't connect to oneanother. In one embodiment, the ground shield metal patterns 300 mayconnect to one another ground shield metal patterns through metalconnection portions 300-1 and 300-2, and are coupled to the individualground node or the ground node of the power net, wherein metalconnection portions 300-1 and 300-2 are positioned in the same layeredlevel. That is to say, the ground shield metal patterns 300 are coupledto ground. The metal connection portions 300-1 and 300-2 may havering-shaped portions, which extend substantially along the outerboundary of the metal patterns 300, to connect the ground shield metalpatterns 300. The ground shield metal patterns 300 may electricallyisolated the inductor 250 from the substrate 200, so that the eddycurrent loss effect can be avoided. Also, problems such as crosstalk andcoupling problems that can occur between the inductor 250 and otherelectrical devices disposed on the substrate 200 can be avoided.

To those skilled in the art, various modifications of the ground shieldmetal patterns 300 in accordance with some embodiments of the disclosureare allowed. Therefore, the ground shield metal patterns may cut theeddy current generated from the induced magnetic field of the inductor250 and along a direction that is perpendicular to the eddy current, theeffect of the eddy current may be reduced, and the quality factor (Q) ofthe inductor 250 can be improved.

Next, FIGS. 3-4 are illustrated to describe cross-sectional views of anintegrated circuit device 500 a in accordance with one embodiment of thedisclosure. The integrated circuit device 500 a includes ametal-oxide-semiconductor (MOS) capacitor 400 a, which is disposeddirectly under the inductor and the ground shield metal patterns 300.FIG. 3 is a cross-sectional view along a line C-C′ of FIG. 2, and FIG. 3is a cross-sectional view along a line D-D′ of FIG. 2. Also, thecross-sectional view shown in FIG. 3 illustrates severalmetal-oxide-semiconductor (MOS) capacitors 400 a disposed underdifferent ground shield metal patterns in accordance with someembodiments of the disclosure. The cross-sectional view shown in FIG. 4illustrates several metal-oxide-semiconductor (MOS) capacitors 400 adisposed under a single ground shield metal pattern in accordance withsome embodiments of the disclosure. To clearly show the relationshipamong of the layered levels of the inductor, ground shield metalpatterns 300, the metal layers and the conductive lines, and therelationship between of the layered levels of the MOS capacitor 400 aand the substrate 200, the metal layers at various layered levels(including the inductor 250) of the interconnection structure areadditionally drawn. Also, the position of the interconnection structure350 is illustrated in FIGS. 3-4.

As shown in FIGS. 3-4, in one embodiment, the MOS capacitor 400 a isdisposed on the p-type substrate 200, and positioned directly under theground shield metal patterns 300. The MOS capacitor 400 a includes awell doped region 202, a gate structure 208, a source 210 and a drain212. The well doped region 202 is formed extending from a surface 201 ofthe substrate to a portion of the substrate 200. Also, the well dopedregion 202 is doped with the p-type impurity material. In someembodiments, the well doped region 202 may be electrically floating. Thegate structure 208 of the MOS capacitor 400 a is disposed on the welldoped region 202. The gate structure 208 includes a gate oxide layer 204and a gate 206 disposed on the gate oxide layer 204. The source 210 andthe drain 212 are respectively formed on the well doped region 202 andextending from the surface 201 of the substrate to a portion of thesubstrate 200. The source 210 and the drain 212 are formed on twoopposite sides of the gate structure 208. The source 210 and the drain212 are doped with the n-type impurity material. In some embodiments,the gate structure 208 serves as one electrode of the MOS capacitor 400a, the source 210 and the drain 212 collectively serve as anotherelectrode of the MOS capacitor 400 a.

Base on the description of the aforementioned embodiments, ametal-oxide-semiconductor (MOS) varactor or a p-type MOS capacitor canbe disposed on the substrate 200 and positioned directly under theground shield metal patterns 300 to achieve the similar technologicaleffect, in accordance with another embodiment of the disclosure.

In the conventional semiconductor technology, the isolation regions,which are formed using the shallow trench isolation (STI) technology,are arranged between well doped regions with different conduction typesto block the leakage current between the well doped regions.Additionally, the well doped regions are formed using the ionimplantation process and the diffusion process in the semiconductortechnology in common use. The uniformity of the ion (impurity)concentration in the well doped regions, however, is hard to controlusing conventional semiconductor technology. Especially, the ionconcentration at the edge of the well doped region is greater than thatin other regions of the well doped region. Therefore, the performance ofthe transistor, which is formed at the edge of the well doped region, isdifferent from that formed in other regions of the well doped region andis defined as the well proximity effect. In the conventional technology,a transistor of the same type may be arranged in the same well dopedregion to reduce the well proximity effect and to optimize the layoutarea.

Please refer to FIG. 3 again, in which the boundaries of the well dopedregion 202 of the MOS capacitor 400 a, which are disposed directly underthe different ground shield metal patterns 300, may be respectivelyaligned to the boundaries of the ground shield metal patterns 300 orpositioned outside the boundaries of the ground shield metal patterns300. It should be noted that the well doped regions 202 of the differentMOS capacitors 400 a, which are positioned under the different groundshield metal patterns 300, are separated from each other to ensure theground shield effect of the ground shield metal patterns 300 to the MOScapacitors 400 a. Additionally, the extending direction of the gate 206,the source 210 and the drain 212 shown in FIG. 3 may substantially beparallel to that of the ground shield metal patterns 300. It should benoted that the p-type well doped region 202 is covered by the groundshield metal patterns 300, and the substrate 200 is positioned in theregion without being covered by the ground shield metal patterns 300 inthe view along the projection direction of the inductor 250 to thesubstrate 200.

Please refer to FIG. 4 again, wherein in another embodiment, theextending direction of the gate 206, the source 210 and the drain 212 ofeach of the MOS capacitors 400 a may substantially be parallel to thatof the ground shield metal patterns 300. The well doped regions 202 ofdifferent MOS capacitors 400 a, which are also disposed directly underthe same ground shield metal pattern 300, may be separated from orconnecting to each other. Alternatively, several individual MOScapacitors 400 a may be positioned directly under a single metal pattern300.

Please refer to FIGS. 2-4 again, the ground shield metal patterns 300and the inductor 250 may be separated by two or more of the metal layerstherebetween. As shown in FIGS. 3 and 4, for example, the ground shieldmetal patterns 300 are formed by the second metal layer (M2), and theinductor 250 is formed by the sixth metal layer (M6) and the seventhmetal layer (M7). The ground shield metal patterns 300 and the inductor250 are separated by three metal layers, which include the metal layer310 formed by the third metal layer (M3), the metal layer 312 formed bythe fourth metal layer (M4) and the metal layer 314 formed by the fifthmetal layer (M5). Also, no routing (conductive line) is arranged in theprojection areas of the ground shield metal patterns 300 and theinductor 250 to the metal layer 310 (M3), the metal layer 312 (M4) andthe metal layer 314 (M5). Additionally, at least two metal patterns302-1 and 302-2, which are parallel to each other, can be positioneddirectly under the ground shield metal patterns 300. The metal patterns302-1 and 302-2 are coupled to the two respective electrodes of the MOScapacitor 400 a. For example, the metal pattern 302-1 is coupled to boththe source 210 and the drain 212 of the MOS capacitor 400 a, and themetal pattern 302-2 is coupled to the gate 206 of the MOS capacitor 400a. The metal patterns 302-1 and 302-2 may serve as the conductive wiresof the electrodes of the MOS capacitor 400 a. The metal pattern 302-1 iscoupled to a ground node of a power net or the ground shield metalpatterns (metal patterns) 300. The metal pattern 302-2 is coupled to thepower node of the power net. That is to say, the metal pattern 302-1 iscoupled to ground. As shown in FIG. 3, the equivalent capacitance of theMOS capacitor 400 a is leveled as C1.

Base on the description of the aforementioned embodiments, in anotherembodiment, the inductor 250 may be also formed by the sixth metal layer(M6), the seventh metal layer (M7), the metal layer 310 formed by thethird metal layer (M3), the metal layer 312 formed by the fourth metallayer (M4) and the metal layer 314 formed by the fifth metal layer (M5).Therefore, the number of turns of the inductor can be three or more.

Please refer to FIGS. 2-4 again, the layered level of the metal pattern302-1 is the same as that of the metal pattern 302-2 in some embodimentsof the disclosure. The metal patterns 302-1 (or 302-2) and ground shieldmetal patterns 300 occupy different respective metal layers of theinterconnection structure 350. The ground shield metal patterns 300 andthe metal patterns 302-1 and 302-2 are separated from one anotherthrough the dielectric layers (not shown) of the interconnectionstructure 350 and parallel to one another. For example, when the groundshield metal patterns 300 are formed by the second metal layer (M2), themetal patterns 302-1 and 302-2 can be formed by the first metal layer(M1). Also, the MOS capacitor 400 a is positioned directly under themetal patterns 302-1 and 302-2. The shapes (profiles) of the metalpatterns 302-1 and 302-2 are similar to that of the corresponding metalpatterns. For example, the metal patterns 302-1, 302-2 may be metalstrips, which have a shape that is the same as or similar to the shapeof the corresponding ground shield metal patterns 300. Furthermore, thewidth of the metal patterns 302-1 and 302-2 can be designed to be lessthan half of the width of the corresponding ground shield metal patterns300. Therefore, a boundary of the metal pattern 302-1 and a boundary ofthe metal pattern 302-2 are respectively positioned within a boundary ofthe corresponding ground shield metal patterns 300 in a plane view (FIG.2). That is to say, the metal patterns 302-1 and 302-2 are respectivelycovered by the corresponding ground shield metal patterns 300 in theplane view to ensure the ground shield effect of the ground shield metalpatterns 300 to the corresponding metal patterns 302-1 and 302-2 and theMOS capacitor 400 a without being affected by the inductor 250.

FIG. 5 is a cross-sectional view along a line C-C′ of FIG. 2, showing anintegrated circuit device 500 b in accordance with another embodiment ofthe disclosure. The integrated circuit device 500 b includes severalmetal-oxide-metal (MOM) capacitors 400 b disposed under different groundshield metal patterns. Elements of the embodiments hereinafter, that arethe same or similar as those previously described with reference toFIGS. 1-4, are not repeated for brevity.

As shown in FIG. 5, in one embodiment, a metal-oxide-metal (MOM)capacitor 400 b is disposed on the substrate 200. The MOM capacitor 400b mainly includes ground shield metal patterns 300, metal patterns302-1, 302-2, and an oxide layer 214, which is disposed among the groundshield metal patterns 300, and metal patterns 302-1, 302-2. The oxidelayer 214 may be a dielectric layer of the interconnection structure350. Additionally, the layered level of the metal pattern 302-1 is thesame as that of the metal pattern 302-2. The layered level occupied bythe metal patterns 302-1 and 302-2 is next to that occupied by theground shield metal patterns 300. For example, when the ground shieldmetal patterns 300 are formed by the second metal layer (M2), the metalpatterns 302-1 and 302-2 can be formed by the first metal layer (M1). Insome other embodiments, the metal patterns 302-1 and 302-2 may beseparated from the ground shield metal patterns 300 through two or moreoxide layers, which are laminated vertically. It should be noted thatthe oxide layers used to separate the metal patterns 302-1 and 302-2from the ground shield metal patterns 300 don't include any metalpatterns embedded therein. In one embodiment, the metal patterns 302-1and 302-2 may serve as electrodes of the MOM capacitor 400 b. The metalpattern 302-1 is coupled to a ground node of a power net or the groundshield metal patterns 300. The metal pattern 302-2 is coupled to thepower node of the power net. That is to say, the metal pattern 302-1 iscoupled to ground. As shown in FIG. 5, the equivalent capacitance of theMOM capacitor 400 b is the sum of the equivalent capacitance of acapacitor between the metal patterns 302-1 and 302-2, which is leveledas C2, and the equivalent capacitance of a capacitor between the metalpatterns 302-2 and 300, which is leveled as C3.

FIG. 6 is a cross-sectional view along a line C-C′ of FIG. 2, showing anintegrated circuit device 500 c in accordance with another embodiment ofthe disclosure. The integrated circuit device 500 c includes severalmetal-oxide-metal (MOM) capacitors 400 c disposed under different groundshield metal patterns. Elements of the embodiments hereinafter, that arethe same or similar as those previously described with reference toFIGS. 1-5, are not repeated for brevity. One of the differences betweenthe integrated circuit device 500 c in FIG. 6 and the integrated circuitdevice 500 b in FIG. 5 is that the integrated circuit device 500 cincludes metal patterns 304-1 and 304-2 and oxide layers 216 and 218.The metal patterns 304-1 and 304-2 are disposed between the groundshield metal patterns 300 and the metal patterns 302-1 and 302-2. Theoxide layer 216 is disposed between the metal patterns 304-1 and 304-2and the metal patterns 302-1 and 302-2. The oxide layer 218 is disposedbetween the metal patterns 304-1 and 304-2 and the ground shield metalpatterns 300. The oxide layers 216 and 218 may both belong to adielectric layer of the interconnection structure 350. Additionally, themetal patterns 302-1 and 302-2 may both belong to the same layered levelof metal of the interconnection structure 350. The metal patterns 304-1and 304-2 may both belong to the same layered level of metal of theinterconnection structure 350. The metal patterns 302-1 and 302-2 arepositioned in the layered level different to the layered levels of themetal patterns 304-1 and 304-2 and the ground shield metal patterns 300.For example, when the ground shield metal patterns 300 are formed by thethird metal layer (M3), the metal patterns 304-1 and 304-2 can be formedby the second metal layer (M2), and the metal patterns 302-1 and 302-2can be formed by the first metal layer (M1). In some other embodiments,the metal patterns 304-1 and 304-2 may be separated from the groundshield metal patterns 300, 302-1 and 302-2 through two or more oxidelayers, which are laminated vertically. It should be noted that theoxide layer does not include any metal patterns embedded therein.

In this embodiment, the metal patterns 302-1, 302-2, 304-1 and 304-2 mayserve as electrodes of the MOM capacitor 400 c. Also, the adjacent metalpatterns of the metal patterns 302-1, 302-2, 304-1 and 304-2 are coupledto different respective nodes. For example, the metal pattern 302-1 iscoupled to the ground node of the power net or the ground shield metalpatterns 300. The metal patterns 302-2 and 304-1, which are adjacent tothe metal pattern 302-1, are coupled to the power node. Also, the metalpattern 304-2, which is adjacent to the metal patterns 302-2 and 304-1,is coupled to the ground node. That is to say, the metal patterns 302-1and 304-2 are coupled to ground. As shown in FIG. 6, the equivalentcapacitance of the MOM capacitor 400 c is the sum of the equivalentcapacitance of a capacitor between the metal patterns 302-1 and 302-2,which is leveled as C4, the equivalent capacitance of a capacitorbetween the metal patterns 302-1 and 304-1, which is leveled as C5, theequivalent capacitance of a capacitor between the metal patterns 302-2and 304-2, which is leveled as C6, the equivalent capacitance of acapacitor between the metal patterns 304-1 and 300, which is leveled asC7, and the equivalent capacitance of a capacitor between the metalpatterns 304-1 and 304-2, which is leveled as C8.

FIG. 7 is a cross-sectional view along a line C-C′ of FIG. 2, showing anintegrated circuit device 500 d in accordance with another embodiment ofthe disclosure. One of the differences between the integrated circuitdevice 500 d in FIG. 7 and the integrated circuit device 500 c in FIG. 6is that the integrated circuit device 500 d includes several MOMcapacitors 400 c, which are disposed under the different ground shieldmetal patterns, and the MOS capacitor 400 a, which is disposed under theMOM capacitors 400 c. Elements of the embodiments hereinafter, that arethe same or similar as those previously described with reference toFIGS. 1-6, are not repeated for brevity. In this embodiment, the metalpatterns 302-1, 302-2, 304-1 and 304-2 may serve as electrodes of theMOM capacitor 400 c. The metal patterns 302-1 and 302-2 may serve aselectrodes of the MOS capacitor 400 a. Also, the adjacent metal patternsof the metal patterns 302-1, 302-2, 304-1 and 304-2 are coupled todifferent respective nodes. For example, the metal pattern 302-1 iscoupled to the ground node of the power net or the ground shield metalpatterns 300. The metal patterns 302-2 and 304-1, which are adjacent tothe metal pattern 302-1, are coupled to the power node. Also, the metalpattern 304-2, which is adjacent to the metal patterns 302-2 and 304-1,is coupled to the ground node. As shown in FIG. 7, the equivalentcapacitance of the integrated circuit device 500 d is the sum of theequivalent capacitance of the MOM capacitor 400 c and the MOS capacitor400 a.

Embodiments provide an integrated circuit device. The integrated circuitdevice is constructed by disposing a metal-oxide-semiconductor (MOS)capacitor and/or a metal-oxide-metal (MOM) capacitor directly under anon-chip-inductor. The MOS capacitor and/or the MOM capacitor ispositioned in a region between ground shield metal patterns, which areused to shield the on-chip-inductor, and a substrate. Also, the MOScapacitor uses two parallel metal patterns, which are positioneddirectly under the ground shield metal patterns and between the MOScapacitor and the ground shield metal patterns, as the conductive linesof the electrodes to couple to the two respective electrodes of the MOScapacitor. Also, the two parallel metal patterns are coupled to a groundnode and a power node of a power net, respectively. The MOM capacitor iscomposed of at least two metal patterns and an oxide layer therebetweenof the interconnection structure. The metal patterns may serve as thetwo electrodes of the MOM capacitor, and may be coupled to the groundnode (or the ground shield metal patterns) and the power node of thepower net, respectively. The equivalent capacitance of the MOM capacitor400 c includes the capacitance of the capacitor, which is composed ofthe two metal patterns and the oxide layer therebetween, and thecapacitance of the capacitors, which is composed of the two metalpatterns, the ground shield metal patterns and the oxide layer. In someembodiments, the arrangement of the capacitor may reduce the area of thecircuit layout. The arrangement of the capacitor also can be integratedwith the semiconductor processes without increasing the cost orrequiring any additional steps in the fabrication process. Additionally,the capacitor disposed directly under the on-chip inductor may be usedas a de-coupling capacitor of the power net. Because the operationfrequency of the de-coupling capacitor is much less than that of theon-chip-inductor, the other integrated circuit devices can be free frominterference from the capacitor (the de-coupling capacitor).

While the invention has been described by way of example and in terms ofthe preferred embodiments, it is to be understood that the invention isnot limited to the disclosed embodiments. On the contrary, it isintended to cover various modifications and similar arrangements (aswould be apparent to those skilled in the art). Therefore, the scope ofthe appended claims should be accorded the broadest interpretation so asto encompass all such modifications and similar arrangements.

What is claimed is:
 1. An integrated circuit device, comprising: asubstrate; a first capacitor disposed on the substrate; a first metalpattern coupled to a first electrode of the first capacitor; a secondmetal pattern coupled to a second electrode of the first capacitor; athird metal pattern disposed over the first and second metal patternsand covering the first capacitor, the first metal pattern, and thesecond metal pattern, wherein the third metal pattern is coupled toground; and an inductor disposed over the third metal pattern, whereinthe first capacitor comprises: a first oxide layer disposed among thefirst, second, and third metal patterns, wherein the first metal patternserves as the first electrode of the first capacitor, the second metalpattern serves as the second electrode of the first capacitor.
 2. Theintegrated circuit device as claimed in claim 1, further comprising: aplurality of metal layers disposed on the substrate, wherein the thirdmetal pattern and the first metal pattern respectively occupy differentmetal layers of the metal layers, and wherein the third metal patternand the second metal pattern respectively occupy different metal layersof the metal layers.
 3. The integrated circuit device as claimed inclaim 1, wherein the third metal pattern is disposed directly under theinductor, wherein the first metal pattern and the second metal patternare disposed directly under the third metal pattern, and wherein aboundary of the first metal pattern and a boundary of the second metalpattern are respectively positioned within a boundary of the third metalpattern in a plane view.
 4. The integrated circuit device as claimed inclaim 1, wherein the first, second, and third metal patterns areseparated from and parallel to one another.
 5. The integrated circuitdevice as claimed in claim 1, wherein the first capacitor is a firstmetal-oxide-metal (MOM) capacitor.
 6. The integrated circuit device asclaimed in claim 1, wherein the first metal pattern and the second metalpattern belong to a first metal layered level, the third metal patternbelongs to a second metal layered level, which is different from thefirst metal layered level.
 7. The integrated circuit device as claimedin claim 1, wherein the first metal pattern belongs to a first metallayered level, the second metal pattern belongs to a second metallayered level, and the third metal pattern belongs to a third metallayered level, wherein the first, second, and third metal layered levelsare different from one another.
 8. The integrated circuit device asclaimed in claim 1, further comprising: a second capacitor disposedbetween the substrate and the third metal pattern.
 9. The integratedcircuit device as claimed in claim 8, wherein the second capacitor is ametal-oxide-semiconductor (MOS) varactor.
 10. The integrated circuitdevice as claimed in claim 9, wherein the second capacitor is a firstmetal-oxide-semiconductor (MOS) capacitor, and the firstmetal-oxide-semiconductor (MOS) capacitor comprises: a first well dopedregion extended from a surface of the substrate to a portion of thesubstrate; a first gate structure disposed on the first well dopedregion; and a source and a drain respectively positioned on two oppositesides of the first gate structure, wherein the first gate structureserves as the first electrode, the source and the drain serve as thesecond electrode.
 11. The integrated circuit device as claimed in claim10, wherein the first well doped region is formed by doping an impuritywithin the substrate.
 12. The integrated circuit device as claimed inclaim 11, wherein the impurity is a p-type impurity or an n-typeimpurity.
 13. The integrated circuit device as claimed in claim 10,further comprising: a third capacitor disposed between the substrate andthe third metal pattern.
 14. The integrated circuit device as claimed inclaim 13, wherein the third capacitor is a secondmetal-oxide-semiconductor (MOS) capacitor, which is positioned parallelto the first metal-oxide-semiconductor (MOS) capacitor, wherein a secondwell doped region of the second metal-oxide-semiconductor (MOS)capacitor is separated from the first well doped region.
 15. Theintegrated circuit device as claimed in claim 14, wherein the thirdmetal pattern comprises a first metal trace and a second metal trace,and the first metal trace fully covers the first well doped region, andthe second metal trace fully covers the second well doped region in aplane view.
 16. The integrated circuit device as claimed in claim 15,wherein the substrate is exposed to a region positioned between thefirst and second metal traces.
 17. The integrated circuit device asclaimed in claim 1, further comprising; a fourth metal pattern betweenthe first metal pattern and the third metal pattern; a fifth metalpattern between the second metal pattern and the third metal pattern;and the first oxide layer disposed among the first, second, third,fourth and fifth metal patterns, wherein the first and fifth metalpatterns serve as the first electrode of the first capacitor, the secondand fourth metal patterns serve as the second electrode of the firstcapacitor.
 18. The integrated circuit device as claimed in claim 17,further comprising: a plurality of metal layers disposed on thesubstrate, wherein the third metal pattern, the first metal pattern andthe fourth metal pattern respectively occupy different metal layers ofthe metal layers, and wherein the third metal pattern, the second metalpattern and the fifth metal pattern respectively occupy different metallayers of the metal layers.
 19. The integrated circuit device as claimedin claim 1, further comprising: a second capacitor disposed between thesubstrate and the first capacitor.
 20. The integrated circuit device asclaimed in claim 19, wherein the second capacitor is ametal-oxide-semiconductor (MOS) varactor or a firstmetal-oxide-semiconductor (MOS) capacitor.